L7C172PC35 vs IDT71681SA35E feature comparison

L7C172PC35 LOGIC Devices Inc

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IDT71681SA35E Integrated Device Technology Inc

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Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer LOGIC DEVICES INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code DIP DFP
Package Description DIP, DIP24,.3 0.300 INCH, CERPACK-24
Pin Count 24 24
Reach Compliance Code unknown not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 35 ns 35 ns
Additional Feature AUTOMATIC POWER-DOWN; HIGH IMPEDANCE WRITE
I/O Type SEPARATE SEPARATE
JESD-30 Code R-PDIP-T24 R-GDFP-F24
JESD-609 Code e0 e0
Length 32.004 mm 15.748 mm
Memory Density 16384 bit 16384 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 4 4
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 24 24
Number of Words 4096 words 4096 words
Number of Words Code 4000 4000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 4KX4 4KX4
Output Characteristics 3-STATE 3-STATE
Output Enable NO NO
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code DIP DFP
Package Equivalence Code DIP24,.3 FL24,.4
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE FLATPACK
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 225
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.572 mm 2.286 mm
Standby Current-Max 0.00005 A 0.002 A
Standby Voltage-Min 2 V 4.5 V
Supply Current-Max 0.05 mA 0.1 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE FLAT
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Width 7.62 mm 9.144 mm
Base Number Matches 1 1

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