L7C172PC35
vs
L7C172CM20
feature comparison
All Stats
Differences Only
Pbfree Code
No
No
Rohs Code
No
No
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
LOGIC DEVICES INC
LOGIC DEVICES INC
Part Package Code
DIP
DIP
Package Description
DIP, DIP24,.3
DIP, DIP24,.3
Pin Count
24
24
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
3A001.A.2.C
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
35 ns
20 ns
Additional Feature
AUTOMATIC POWER-DOWN; HIGH IMPEDANCE WRITE
AUTOMATIC POWER-DOWN; HIGH IMPEDANCE WRITE
I/O Type
SEPARATE
SEPARATE
JESD-30 Code
R-PDIP-T24
R-GDIP-T24
JESD-609 Code
e0
e0
Length
32.004 mm
31.75 mm
Memory Density
16384 bit
16384 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
4
4
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
24
24
Number of Words
4096 words
4096 words
Number of Words Code
4000
4000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-55 °C
Organization
4KX4
4KX4
Output Characteristics
3-STATE
3-STATE
Output Enable
NO
NO
Package Body Material
PLASTIC/EPOXY
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Equivalence Code
DIP24,.3
DIP24,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
225
225
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.572 mm
5.08 mm
Standby Current-Max
0.00005 A
0.00005 A
Standby Voltage-Min
2 V
2 V
Supply Current-Max
0.05 mA
0.09 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
MILITARY
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
7.62 mm
Base Number Matches
1
1
Compare L7C172PC35 with alternatives
Compare L7C172CM20 with alternatives