L7C172PC35 vs L7C172CM20 feature comparison

L7C172PC35 LOGIC Devices Inc

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L7C172CM20 LOGIC Devices Inc

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Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer LOGIC DEVICES INC LOGIC DEVICES INC
Part Package Code DIP DIP
Package Description DIP, DIP24,.3 DIP, DIP24,.3
Pin Count 24 24
Reach Compliance Code unknown unknown
ECCN Code EAR99 3A001.A.2.C
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 35 ns 20 ns
Additional Feature AUTOMATIC POWER-DOWN; HIGH IMPEDANCE WRITE AUTOMATIC POWER-DOWN; HIGH IMPEDANCE WRITE
I/O Type SEPARATE SEPARATE
JESD-30 Code R-PDIP-T24 R-GDIP-T24
JESD-609 Code e0 e0
Length 32.004 mm 31.75 mm
Memory Density 16384 bit 16384 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 4 4
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 24 24
Number of Words 4096 words 4096 words
Number of Words Code 4000 4000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Organization 4KX4 4KX4
Output Characteristics 3-STATE 3-STATE
Output Enable NO NO
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP24,.3 DIP24,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 225 225
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.572 mm 5.08 mm
Standby Current-Max 0.00005 A 0.00005 A
Standby Voltage-Min 2 V 2 V
Supply Current-Max 0.05 mA 0.09 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 1 1

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