L7C167DME15 vs 6167LA35D feature comparison

L7C167DME15 LOGIC Devices Inc

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6167LA35D Integrated Device Technology Inc

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer LOGIC DEVICES INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code DIP DIP
Package Description DIP, DIP20,.3 0.300 INCH, CERAMIC, DIP-20
Pin Count 20 20
Reach Compliance Code unknown not_compliant
ECCN Code 3A001.A.2.C EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 15 ns 35 ns
Additional Feature AUTOMATIC POWER-DOWN
I/O Type SEPARATE SEPARATE
JESD-30 Code R-CDIP-T20 R-CDIP-T20
JESD-609 Code e0 e0
Length 25.4 mm
Memory Density 16384 bit 16384 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 1 1
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Ports 1
Number of Terminals 20 20
Number of Words 16384 words 16384 words
Number of Words Code 16000 16000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Organization 16KX1 16KX1
Output Characteristics 3-STATE 3-STATE
Output Enable NO
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code DIP DIP
Package Equivalence Code DIP20,.3 DIP20,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 225
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883 Class B (Modified)
Seated Height-Max 4.953 mm
Standby Current-Max 0.0001 A 0.00002 A
Standby Voltage-Min 2 V 2 V
Supply Current-Max 0.08 mA 0.065 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY COMMERCIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm
Base Number Matches 1 1

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