L7C108PC25 vs L7C108CM25 feature comparison

L7C108PC25 LOGIC Devices Inc

Buy Now Datasheet

L7C108CM25 LOGIC Devices Inc

Buy Now Datasheet
Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer LOGIC DEVICES INC LOGIC DEVICES INC
Part Package Code DIP DIP
Package Description 0.400 INCH, PLASTIC, DIP-32 DIP, DIP32,.4
Pin Count 32 32
Reach Compliance Code unknown unknown
ECCN Code EAR99 3A001.A.2.C
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 25 ns 25 ns
Additional Feature AUTOMATIC POWER-DOWN
I/O Type COMMON COMMON
JESD-30 Code R-PDIP-T32 R-GDIP-T32
JESD-609 Code e0 e0
Length 40.64 mm
Memory Density 1048576 bit 1048576 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 32 32
Number of Words 131072 words 131072 words
Number of Words Code 128000 128000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Organization 128KX8 128KX8
Output Characteristics 3-STATE 3-STATE
Output Enable NO YES
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP32,.3 DIP32,.4
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 225 225
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.445 mm
Standby Current-Max 0.001 A 0.001 A
Standby Voltage-Min 2 V 2 V
Supply Current-Max 0.145 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 10.16 mm
Base Number Matches 1 1

Compare L7C108PC25 with alternatives

Compare L7C108CM25 with alternatives