L7C108KMB12
vs
AP9A110L-12VI
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
LOGIC DEVICES INC
APTOS SEMICONDUCTOR CORP
Part Package Code
QFJ
Package Description
QCCN,
,
Pin Count
32
Reach Compliance Code
unknown
unknown
ECCN Code
3A001.A.2.C
3A991.B.2.B
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
12 ns
12 ns
Additional Feature
AUTOMATIC POWER DOWN; BATTERY BACKUP
JESD-30 Code
R-CQCC-N32
R-PDSO-J32
Length
17.78 mm
Memory Density
1048576 bit
1048576 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
8
8
Moisture Sensitivity Level
3
Number of Functions
1
1
Number of Terminals
32
32
Number of Words
131072 words
131072 words
Number of Words Code
128000
128000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Organization
128KX8
128KX8
Package Body Material
CERAMIC, METAL-SEALED COFIRED
PLASTIC/EPOXY
Package Code
QCCN
SOJ
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
CHIP CARRIER
SMALL OUTLINE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
225
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.54 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Form
NO LEAD
J BEND
Terminal Pitch
1.27 mm
Terminal Position
QUAD
DUAL
Width
11.43 mm
Base Number Matches
1
1
Compare L7C108KMB12 with alternatives
Compare AP9A110L-12VI with alternatives