L7C108DC10
vs
KM681002CTI-1000
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
LOGIC DEVICES INC
|
SAMSUNG SEMICONDUCTOR INC
|
| Part Package Code |
DIP
|
TSOP2
|
| Package Description |
DIP,
|
TSOP2,
|
| Pin Count |
32
|
32
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
3A991.B.2.B
|
3A991.B.2.B
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Access Time-Max |
10 ns
|
10 ns
|
| Additional Feature |
AUTOMATIC POWER DOWN; BATTERY BACKUP
|
|
| JESD-30 Code |
R-CDIP-T32
|
R-PDSO-G32
|
| Length |
40.64 mm
|
20.95 mm
|
| Memory Density |
1048576 bit
|
1048576 bit
|
| Memory IC Type |
STANDARD SRAM
|
STANDARD SRAM
|
| Memory Width |
8
|
8
|
| Moisture Sensitivity Level |
3
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
32
|
32
|
| Number of Words |
131072 words
|
131072 words
|
| Number of Words Code |
128000
|
128000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Organization |
128KX8
|
128KX8
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
TSOP2
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE, THIN PROFILE
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Peak Reflow Temperature (Cel) |
225
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.953 mm
|
1.2 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
10.16 mm
|
10.16 mm
|
| Base Number Matches |
2
|
1
|
|
|
|
Compare L7C108DC10 with alternatives
Compare KM681002CTI-1000 with alternatives