L6116MMB20
vs
8403609KX
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
LOGIC DEVICES INC
QP SEMICONDUCTOR INC
Part Package Code
DFP
DFP
Package Description
DFP, FL24,.4
DFP,
Pin Count
24
24
Reach Compliance Code
unknown
unknown
ECCN Code
3A001.A.2.C
3A001.A.2.C
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
20 ns
45 ns
Additional Feature
AUTOMATIC POWER-DOWN
I/O Type
COMMON
JESD-30 Code
R-CDFP-F24
R-GDFP-F24
JESD-609 Code
e0
Length
16.002 mm
Memory Density
16384 bit
16384 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
8
8
Moisture Sensitivity Level
3
Number of Functions
1
1
Number of Ports
1
Number of Terminals
24
24
Number of Words
2048 words
2048 words
Number of Words Code
2000
2000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
2KX8
2KX8
Output Characteristics
3-STATE
Output Enable
YES
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, GLASS-SEALED
Package Code
DFP
DFP
Package Equivalence Code
FL24,.4
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLATPACK
FLATPACK
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
225
Qualification Status
Not Qualified
Not Qualified
Screening Level
38535Q/M;38534H;883B
Seated Height-Max
2.286 mm
Standby Current-Max
0.00015 A
Standby Voltage-Min
2 V
Supply Current-Max
0.135 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
Terminal Form
FLAT
FLAT
Terminal Pitch
1.27 mm
Terminal Position
DUAL
DUAL
Width
9.017 mm
Base Number Matches
1
5
Compare L6116MMB20 with alternatives
Compare 8403609KX with alternatives