L53C80DC2
vs
L53C80DMB2
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
LOGIC DEVICES INC
|
LOGIC DEVICES INC
|
| Part Package Code |
DIP
|
DIP
|
| Package Description |
DIP, DIP48,.6
|
DIP, DIP48,.6
|
| Pin Count |
48
|
48
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Additional Feature |
ICC SPECIFIED @ 4MHZ
|
ICC SPECIFIED @ 4MHZ
|
| Address Bus Width |
3
|
3
|
| Data Transfer Rate-Max |
2 MBps
|
2 MBps
|
| Drive Interface Standard |
X3T9.2
|
X3T9.2
|
| External Data Bus Width |
8
|
8
|
| JESD-30 Code |
R-CDIP-T48
|
R-CDIP-T48
|
| JESD-609 Code |
e0
|
e0
|
| Length |
60.96 mm
|
60.96 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Terminals |
48
|
48
|
| Operating Temperature-Max |
70 °C
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP48,.6
|
DIP48,.6
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
225
|
225
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.953 mm
|
4.953 mm
|
| Supply Current-Max |
20 mA
|
20 mA
|
| Supply Voltage-Max |
5.25 V
|
5.5 V
|
| Supply Voltage-Min |
4.75 V
|
4.5 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
MILITARY
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
15.24 mm
|
15.24 mm
|
| uPs/uCs/Peripheral ICs Type |
BUS CONTROLLER, SCSI
|
BUS CONTROLLER, SCSI
|
| Base Number Matches |
1
|
1
|
| ECCN Code |
|
3A001.A.2.C
|
| Screening Level |
|
38535Q/M;38534H;883B
|
|
|
|
Compare L53C80DC2 with alternatives
Compare L53C80DMB2 with alternatives