L4X8E6AP
vs
Z0107MA,116
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
LITTELFUSE INC
|
NXP SEMICONDUCTORS
|
| Part Package Code |
TO-92
|
TO-92
|
| Package Description |
CYLINDRICAL, O-PBCY-T3
|
PLASTIC, TO-92, 3 PIN
|
| Pin Count |
3
|
3
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.30.00.80
|
8541.30.00.80
|
| Configuration |
SINGLE
|
SINGLE
|
| Critical Rate of Rise of Commutation Voltage-Min |
1 V/us
|
|
| Critical Rate of Rise of Off-State Voltage-Min |
25 V/us
|
20 V/us
|
| DC Gate Trigger Current-Max |
10 mA
|
7 mA
|
| DC Gate Trigger Voltage-Max |
1.3 V
|
1.3 V
|
| Holding Current-Max |
10 mA
|
10 mA
|
| JEDEC-95 Code |
TO-92
|
TO-92
|
| JESD-30 Code |
O-PBCY-T3
|
O-PBCY-T3
|
| JESD-609 Code |
e3
|
e3
|
| Leakage Current-Max |
0.1 mA
|
0.5 mA
|
| Moisture Sensitivity Level |
2
|
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
3
|
3
|
| On-State Voltage-Max |
1.6 V
|
|
| On-state Current-Max |
800 A
|
|
| Operating Temperature-Max |
110 °C
|
125 °C
|
| Operating Temperature-Min |
-65 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
ROUND
|
ROUND
|
| Package Style |
CYLINDRICAL
|
CYLINDRICAL
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RMS On-state Current-Max |
800 A
|
1 A
|
| Repetitive Peak Off-state Leakage Current-Max |
0.1 µA
|
|
| Repetitive Peak Off-state Voltage |
400 V
|
600 V
|
| Repetitive Peak Reverse Voltage |
400 V
|
|
| Surface Mount |
NO
|
NO
|
| Terminal Finish |
MATTE TIN
|
TIN
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
30
|
| Trigger Device Type |
TRIAC
|
4 QUADRANT LOGIC LEVEL TRIAC
|
| Base Number Matches |
2
|
2
|
| Manufacturer Package Code |
|
SOT54
|
|
|
|
Compare L4X8E6AP with alternatives
Compare Z0107MA,116 with alternatives