L0603C1R8KSMST
vs
GLF16081R8K-T
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
KEMET ELECTRONICS CORP
|
CAL-CHIP ELECTRONICS INC
|
| Package Description |
0603
|
0603
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8504.50.80.00
|
8504.50.80.00
|
| Case/Size Code |
0603
|
0603
|
| Construction |
Multilayer Chip
|
Chip
|
| Core Material |
Ferrite
|
|
| DC Resistance |
0.95 Ω
|
0.95 Ω
|
| Inductance-Nom (L) |
1.8 µH
|
1.8 µH
|
| Inductor Application |
RF INDUCTOR
|
RF INDUCTOR
|
| Inductor Type |
GENERAL PURPOSE INDUCTOR
|
GENERAL PURPOSE INDUCTOR
|
| JESD-609 Code |
e3
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Height |
0.8 mm
|
0.8 mm
|
| Package Length |
1.6 mm
|
1.6 mm
|
| Package Style |
SMT
|
SMT
|
| Package Width |
0.8 mm
|
0.8 mm
|
| Packing Method |
TR
|
TR
|
| Quality Factor-Min (at L-nom) |
35
|
35
|
| Rated Current-Max |
0.025 A
|
0.025 A
|
| Self Resonance Frequency |
50 MHz
|
50 MHz
|
| Shape/Size Description |
RECTANGULAR PACKAGE
|
RECTANGULAR PACKAGE
|
| Shielded |
YES
|
YES
|
| Surface Mount |
YES
|
YES
|
| Terminal Finish |
Matte Tin (Sn)
|
|
| Terminal Placement |
DUAL ENDED
|
DUAL ENDED
|
| Terminal Shape |
WRAPAROUND
|
WRAPAROUND
|
| Test Frequency |
10 MHz
|
|
| Tolerance |
10%
|
10%
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| Special Feature |
|
MULTILAYER
|
|
|
|
Compare L0603C1R8KSMST with alternatives
Compare GLF16081R8K-T with alternatives