L-0508M1R60GBWS
vs
L-0508M1R60GSWS
feature comparison
All Stats
Differences Only
Rohs Code
No
Yes
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
VISHAY INTERTECHNOLOGY INC
VISHAY INTERTECHNOLOGY INC
Package Description
CHIP
CHIP
Reach Compliance Code
compliant
compliant
Construction
Rectangular
Rectangular
JESD-609 Code
e0
e1
Mounting Feature
SURFACE MOUNT
SURFACE MOUNT
Number of Terminals
2
2
Operating Temperature-Max
155 °C
155 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Height
0.508 mm
0.508 mm
Package Length
1.194 mm
1.194 mm
Package Style
SMT
SMT
Package Width
2.01 mm
2.01 mm
Packing Method
WAFFLE PACK
WAFFLE PACK
Rated Power Dissipation (P)
0.4 W
0.4 W
Rated Temperature
70 °C
70 °C
Resistance
1.6 Ω
1.6 Ω
Resistor Type
FIXED RESISTOR
FIXED RESISTOR
Size Code
0508
0508
Surface Mount
YES
YES
Technology
THIN FILM
THIN FILM
Temperature Coefficient
300 ppm/°C
300 ppm/°C
Terminal Finish
Tin/Lead (Sn63Pb37) - with Nickel (Ni) barrier
TIN SILVER COPPER
Terminal Shape
WRAPAROUND
WRAPAROUND
Tolerance
2%
2%
Working Voltage
0.8 V
0.8 V
Base Number Matches
1
1
ECCN Code
EAR99
HTS Code
8533.21.00.30
Compare L-0508M1R60GBWS with alternatives
Compare L-0508M1R60GSWS with alternatives