KXPC857TZP100B vs TSXPC860MHVZPU40C feature comparison

KXPC857TZP100B Motorola Semiconductor Products

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TSXPC860MHVZPU40C Teledyne e2v

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer MOTOROLA INC ATMEL GRENOBLE
Package Description 23 X 23 MM, PLASTIC, BGA-357 ,
Reach Compliance Code unknown unknown
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 32 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 10 MHz 40 MHz
External Data Bus Width 32 32
Format FIXED POINT FIXED POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B357 S-PBGA-B357
Low Power Mode YES YES
Number of Terminals 357 357
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Qualification Status Not Qualified Not Qualified
Speed 100 MHz 40 MHz
Supply Voltage-Max 3.6 V 3.465 V
Supply Voltage-Min 3 V 3.135 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Form BALL BALL
Terminal Position BOTTOM BOTTOM
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 3 3
Part Package Code BGA
Pin Count 357
ECCN Code 3A991.A.2

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