KUINTEL386EX20
vs
TS68020VF125
feature comparison
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
INTEL CORP
|
TELEDYNE E2V (UK) LTD
|
| Part Package Code |
QFP
|
QFP
|
| Package Description |
BQFP,
|
QFP,
|
| Pin Count |
132
|
132
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
3A991.A.2
|
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Additional Feature |
DRAM REFRESH CONTROLLER; NUMERIC COPROCESSOR INTERFACE
|
|
| Address Bus Width |
26
|
32
|
| Bit Size |
32
|
32
|
| Boundary Scan |
YES
|
NO
|
| Clock Frequency-Max |
40 MHz
|
25 MHz
|
| External Data Bus Width |
16
|
32
|
| Format |
FIXED POINT
|
FIXED POINT
|
| Integrated Cache |
NO
|
YES
|
| JESD-30 Code |
S-PQFP-G132
|
S-CQFP-G132
|
| Length |
24.13 mm
|
24.13 mm
|
| Low Power Mode |
YES
|
YES
|
| Number of DMA Channels |
2
|
|
| Number of External Interrupts |
10
|
|
| Number of Serial I/Os |
2
|
|
| Number of Terminals |
132
|
132
|
| On Chip Data RAM Width |
|
|
| Operating Temperature-Max |
74 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
BQFP
|
QFP
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, BUMPER
|
FLATPACK
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (words) |
0
|
|
| Seated Height-Max |
4.32 mm
|
3.43 mm
|
| Speed |
20 MHz
|
25 MHz
|
| Supply Current-Max |
130 mA
|
|
| Supply Voltage-Max |
3.6 V
|
5.5 V
|
| Supply Voltage-Min |
3 V
|
4.5 V
|
| Supply Voltage-Nom |
3.3 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
HCMOS
|
| Temperature Grade |
COMMERCIAL EXTENDED
|
INDUSTRIAL
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.635 mm
|
0.635 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
24.13 mm
|
24.13 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR
|
MICROPROCESSOR
|
| Base Number Matches |
1
|
1
|
| Rohs Code |
|
No
|
|
|
|
Compare KUINTEL386EX20 with alternatives
Compare TS68020VF125 with alternatives