KU82309SX16
vs
KD8230925
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEL CORP
INTEL CORP
Part Package Code
QFP
QFP
Package Description
BQFP,
BQFP,
Pin Count
100
100
Reach Compliance Code
unknown
unknown
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
11
11
Boundary Scan
NO
NO
External Data Bus Width
8
8
JESD-30 Code
S-PQFP-G100
S-PQFP-G100
Length
19.05 mm
19.05 mm
Low Power Mode
NO
NO
Number of Banks
4
4
Number of Terminals
100
100
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BQFP
BQFP
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, BUMPER
FLATPACK, BUMPER
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.572 mm
4.572 mm
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
4.5 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
YES
Technology
CHMOS
CHMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.635 mm
0.635 mm
Terminal Position
QUAD
QUAD
Width
19.05 mm
19.05 mm
uPs/uCs/Peripheral ICs Type
MEMORY CONTROLLER, DRAM
MEMORY CONTROLLER, DRAM
Base Number Matches
1
1
Compare KU82309SX16 with alternatives
Compare KD8230925 with alternatives