KU8230925 vs DP8441VLJ-25 feature comparison

KU8230925 Intel Corporation

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DP8441VLJ-25 National Semiconductor Corporation

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEL CORP NATIONAL SEMICONDUCTOR CORP
Part Package Code QFP
Package Description PLASTIC, QFP-100 QFP, QFP100,.7X.9
Pin Count 100
Reach Compliance Code compliant unknown
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 11 26
Boundary Scan NO NO
External Data Bus Width 8
JESD-30 Code S-PQFP-G100 R-PQFP-G100
JESD-609 Code e0 e0
Length 19.05 mm 20 mm
Low Power Mode NO NO
Number of Banks 4 4
Number of Terminals 100 100
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BQFP QFP
Package Equivalence Code SPQFP100,.9SQ QFP100,.7X.9
Package Shape SQUARE RECTANGULAR
Package Style FLATPACK, BUMPER FLATPACK
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.572 mm 3 mm
Supply Current-Max 180 mA 260 mA
Supply Voltage-Max 5.5 V 5.25 V
Supply Voltage-Min 4.5 V 4.75 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology CHMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb) TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.635 mm 0.65 mm
Terminal Position QUAD QUAD
Width 19.05 mm 14 mm
uPs/uCs/Peripheral ICs Type MEMORY CONTROLLER, DRAM MEMORY CONTROLLER, DRAM
Base Number Matches 1 1
Clock Frequency-Max 25 MHz
Memory Organization 64M X 1

Compare KU8230925 with alternatives

Compare DP8441VLJ-25 with alternatives