KU80960CA-16
vs
TS68040VF25A
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
INTEL CORP
|
TELEDYNE E2V (UK) LTD
|
| Package Description |
QFP, SPQFP196,1.5SQ
|
CAVITY UP, CERAMIC, QFP-196
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
3A991.A.2
|
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
32
|
32
|
| Bit Size |
32
|
32
|
| Boundary Scan |
NO
|
YES
|
| Clock Frequency-Max |
32 MHz
|
25 MHz
|
| External Data Bus Width |
32
|
32
|
| Format |
FIXED POINT
|
FLOATING POINT
|
| Integrated Cache |
NO
|
YES
|
| JESD-30 Code |
S-PQFP-G196
|
S-CQFP-G196
|
| Length |
34.29 mm
|
33.91 mm
|
| Low Power Mode |
NO
|
NO
|
| Moisture Sensitivity Level |
1
|
|
| Number of DMA Channels |
4
|
|
| Number of External Interrupts |
9
|
|
| Number of Serial I/Os |
|
|
| Number of Terminals |
196
|
196
|
| On Chip Data RAM Width |
8
|
|
| Operating Temperature-Max |
100 °C
|
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
QFP
|
LQFP
|
| Package Equivalence Code |
SPQFP196,1.5SQ
|
QFP196,1.5SQ
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK
|
FLATPACK, LOW PROFILE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (words) |
512
|
|
| Seated Height-Max |
4.57 mm
|
|
| Speed |
16 MHz
|
25 MHz
|
| Supply Current-Max |
550 mA
|
|
| Supply Voltage-Max |
5.5 V
|
5.25 V
|
| Supply Voltage-Min |
4.5 V
|
4.75 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
MOS
|
HCMOS
|
| Temperature Grade |
OTHER
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.635 mm
|
0.635 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
34.29 mm
|
33.91 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR
|
| Base Number Matches |
1
|
1
|
| Part Package Code |
|
QFP
|
| Pin Count |
|
196
|
|
|
|
Compare KU80960CA-16 with alternatives
Compare TS68040VF25A with alternatives