KU80486SX16LOWPOWER
vs
TS68040DESC02ZC
feature comparison
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
INTEL CORP
|
ATMEL CORP
|
| Part Package Code |
QFP
|
QFP
|
| Package Description |
BQFP,
|
QFP,
|
| Pin Count |
196
|
196
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Additional Feature |
DYNAMIC BUS SIZING; BURST BUS; MULTIPROCESSOR SUPPORT; BUILT IN SELF TEST; DYNAMIC FREQ SCALABILITY
|
|
| Address Bus Width |
32
|
32
|
| Bit Size |
32
|
32
|
| Boundary Scan |
YES
|
YES
|
| Clock Frequency-Max |
32 MHz
|
33 MHz
|
| External Data Bus Width |
32
|
32
|
| Format |
FIXED POINT
|
FLOATING POINT
|
| Integrated Cache |
YES
|
YES
|
| JESD-30 Code |
S-PQFP-G196
|
S-CQFP-G196
|
| Length |
34.29 mm
|
33.91 mm
|
| Low Power Mode |
YES
|
NO
|
| Number of DMA Channels |
|
|
| Number of External Interrupts |
2
|
|
| Number of Serial I/Os |
|
|
| Number of Terminals |
196
|
196
|
| On Chip Data RAM Width |
|
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
BQFP
|
QFP
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, BUMPER
|
FLATPACK
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (words) |
0
|
|
| Seated Height-Max |
4.57 mm
|
4.19 mm
|
| Speed |
16 MHz
|
33 MHz
|
| Supply Current-Max |
450 mA
|
|
| Supply Voltage-Max |
5.25 V
|
5.25 V
|
| Supply Voltage-Min |
4.5 V
|
4.75 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
HCMOS
|
| Temperature Grade |
OTHER
|
MILITARY
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.635 mm
|
0.635 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
34.29 mm
|
33.91 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR
|
MICROPROCESSOR
|
| Base Number Matches |
1
|
4
|
|
|
|
Compare KU80486SX16LOWPOWER with alternatives
Compare TS68040DESC02ZC with alternatives