KT8557BJ vs TCM29C23N feature comparison

KT8557BJ Samsung Semiconductor

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TCM29C23N Texas Instruments

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC TEXAS INSTRUMENTS INC
Part Package Code DIP
Package Description DIP, DIP16,.3 DIP, DIP20,.3
Pin Count 16
Reach Compliance Code compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Companding Law A-LAW A/MU-LAW
Filter YES YES
Gain Tolerance-Max 0.15 dB 0.5 dB
JESD-30 Code R-GDIP-T16 R-PDIP-T20
JESD-609 Code e0
Length 19.495 mm 24.325 mm
Linear Coding NOT AVAILABLE NOT AVAILABLE
Neg Supply Voltage-Nom -5 V -5 V
Number of Functions 1 1
Number of Terminals 16 20
Operating Mode SYNCHRONOUS SYNCHRONOUS/ASYNCHRONOUS
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -25 °C
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP16,.3 DIP20,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 5.08 mm
Supply Current-Max 0.009 mA 9 mA
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Telecom IC Type PCM CODEC PCM CODEC
Temperature Grade OTHER COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 1 1
Pbfree Code No
Additional Feature FULL DUPLEX
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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Compare TCM29C23N with alternatives