KSZ8995M
vs
KS8995MAI
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
MICREL INC
|
MICREL INC
|
Package Description |
LEAD FREE, PLASTIC, QFP-128
|
PLASTIC, QFP-128
|
Reach Compliance Code |
compliant
|
not_compliant
|
JESD-30 Code |
R-PQFP-G128
|
R-PQFP-G128
|
JESD-609 Code |
e3
|
e0
|
Length |
20 mm
|
20 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of Functions |
1
|
1
|
Number of Terminals |
128
|
128
|
Operating Temperature-Max |
70 °C
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
FQFP
|
FQFP
|
Package Equivalence Code |
QFP128,.67X.93,20
|
QFP128,.67X.93,20
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
FLATPACK, FINE PITCH
|
FLATPACK, FINE PITCH
|
Peak Reflow Temperature (Cel) |
260
|
240
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
3.4 mm
|
3.4 mm
|
Supply Current-Max |
0.25 mA
|
|
Supply Voltage-Nom |
1.8 V
|
1.8 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Telecom IC Type |
LAN SWITCHING CIRCUIT
|
LAN SWITCHING CIRCUIT
|
Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
Terminal Finish |
Matte Tin (Sn)
|
Tin/Lead (Sn85Pb15)
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
40
|
30
|
Width |
14 mm
|
14 mm
|
Base Number Matches |
2
|
2
|
|
|
|