KSZ8993MI-TR
vs
KS8993FLI
feature comparison
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICREL INC
|
Package Description |
QFP-128
|
FQFP, QFP128,.67X.93,20
|
Reach Compliance Code |
compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Date Of Intro |
2019-10-04
|
|
JESD-30 Code |
R-PQFP-G128
|
R-PQFP-G128
|
Length |
20 mm
|
20 mm
|
Number of Functions |
1
|
1
|
Number of Terminals |
128
|
128
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
FQFP
|
FQFP
|
Package Equivalence Code |
QFP128,.68X.91,20
|
QFP128,.67X.93,20
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
FLATPACK, FINE PITCH
|
FLATPACK, FINE PITCH
|
Seated Height-Max |
3.4 mm
|
3.4 mm
|
Supply Voltage-Nom |
1.8 V
|
1.8 V
|
Surface Mount |
YES
|
YES
|
Telecom IC Type |
ETHERNET SWITCH
|
LAN SWITCHING CIRCUIT
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
14 mm
|
14 mm
|
Base Number Matches |
1
|
2
|
Rohs Code |
|
No
|
Part Package Code |
|
QFP
|
Pin Count |
|
128
|
JESD-609 Code |
|
e0
|
Moisture Sensitivity Level |
|
3
|
Peak Reflow Temperature (Cel) |
|
240
|
Qualification Status |
|
Not Qualified
|
Technology |
|
CMOS
|
Terminal Finish |
|
TIN LEAD
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare KSZ8993MI-TR with alternatives
Compare KS8993FLI with alternatives