KSZ8864CNXUB-TR
vs
KSZ8864RMNUB-VAO
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Package Description
QFN-64
QFN-64
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Date Of Intro
2018-09-14
Additional Feature
SEATED HT-CALCULATED
SEATED HT-CALCULATED
JESD-30 Code
S-XQCC-N64
S-XQCC-N64
Length
8 mm
8 mm
Number of Functions
1
1
Number of Terminals
64
64
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Code
HVQCCN
HVQCCN
Package Equivalence Code
LCC64,.32SQ,16
LCC64,.32SQ,16
Package Shape
SQUARE
SQUARE
Package Style
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Seated Height-Max
0.9 mm
0.9 mm
Supply Voltage-Nom
1.2 V
1.2 V
Surface Mount
YES
YES
Telecom IC Type
ETHERNET SWITCH
ETHERNET SWITCH
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
0.4 mm
0.4 mm
Terminal Position
QUAD
QUAD
Width
8 mm
8 mm
Base Number Matches
1
1
Rohs Code
JESD-609 Code
e3
Peak Reflow Temperature (Cel)
260
Screening Level
AEC-Q100
Terminal Finish
MATTE TIN
Time@Peak Reflow Temperature-Max (s)
30
Compare KSZ8864CNXUB-TR with alternatives
Compare KSZ8864RMNUB-VAO with alternatives