KSZ8864CNXIA
vs
KSZ8864RMNUB
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
8 X 8 MM, LEAD FREE, QFN-64
|
QFN-64
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
5A991.B.1
|
5A991.B.1
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
4 Weeks
|
10 Weeks
|
Samacsys Manufacturer |
Microchip
|
Microchip
|
JESD-30 Code |
S-XQCC-N64
|
S-XQCC-N64
|
JESD-609 Code |
e3
|
e3
|
Length |
8 mm
|
8 mm
|
Number of Functions |
1
|
1
|
Number of Terminals |
64
|
64
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
Package Code |
HVQCCN
|
HVQCCN
|
Package Equivalence Code |
LCC64,.32SQ,16
|
LCC64,.32SQ,16
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Seated Height-Max |
0.9 mm
|
0.9 mm
|
Supply Voltage-Nom |
1.2 V
|
1.2 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
|
Telecom IC Type |
ETHERNET SWITCH
|
ETHERNET SWITCH
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
MATTE TIN
|
MATTE TIN
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.4 mm
|
0.4 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
8 mm
|
8 mm
|
Base Number Matches |
2
|
4
|
Additional Feature |
|
SEATED HT-CALCULATED
|
Moisture Sensitivity Level |
|
3
|
Screening Level |
|
AEC-Q100; TS 16949
|
Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
Compare KSZ8864CNXIA with alternatives
Compare KSZ8864RMNUB with alternatives