KSZ8567STXV-VAO vs BCM53101MIMLG feature comparison

KSZ8567STXV-VAO Microchip Technology Inc

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BCM53101MIMLG Broadcom Limited

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer MICROCHIP TECHNOLOGY INC BROADCOM LTD
Package Description TQFP-128 , SLGA132,18X18,20
Reach Compliance Code compliant compliant
ECCN Code EAR99
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code S-PQFP-G128
Length 14 mm
Number of Functions 1
Number of Terminals 128 132
Operating Temperature-Max 105 °C 70 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HTFQFP
Package Equivalence Code TQFP128,.63SQ,16 SLGA132,18X18,20
Package Shape SQUARE
Package Style FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH
Screening Level AEC-Q100
Seated Height-Max 1.2 mm
Supply Voltage-Nom 1.2 V
Surface Mount YES YES
Telecom IC Type ETHERNET SWITCH ETHERNET TRANSCEIVER
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Form GULL WING
Terminal Pitch 0.4 mm
Terminal Position QUAD
Width 14 mm
Base Number Matches 1 2
Rohs Code Yes
Factory Lead Time 50 Weeks
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Supply Current-Max 203.6 mA
Technology CMOS

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