KS8993I vs KS8993FLI feature comparison

KS8993I Microchip Technology Inc

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KS8993FLI Microchip Technology Inc

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICREL INC
Part Package Code QFP QFP
Pin Count 128 128
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-PQFP-G128 R-PQFP-G128
JESD-609 Code e0 e0
Length 20 mm 20 mm
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 128 128
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code FQFP FQFP
Package Equivalence Code QFP128,.67X.93,20 QFP128,.67X.93,20
Package Shape RECTANGULAR RECTANGULAR
Package Style FLATPACK, FINE PITCH FLATPACK, FINE PITCH
Peak Reflow Temperature (Cel) 240 240
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.4 mm 3.4 mm
Supply Voltage-Nom 2.5 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Telecom IC Type INTERFACE CIRCUIT LAN SWITCHING CIRCUIT
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30 30
Width 14 mm 14 mm
Base Number Matches 2 2
Rohs Code No
Package Description FQFP, QFP128,.67X.93,20

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