KS8993
vs
KSZ8993
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Transferred
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICREL INC
|
Part Package Code |
QFP
|
|
Pin Count |
128
|
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
|
JESD-30 Code |
R-PQFP-G128
|
R-PQFP-G128
|
JESD-609 Code |
e0
|
e3
|
Length |
20 mm
|
20 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of Functions |
1
|
1
|
Number of Terminals |
128
|
128
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
FQFP
|
FQFP
|
Package Equivalence Code |
QFP128,.67X.93,20
|
QFP128,.67X.93,20
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
FLATPACK, FINE PITCH
|
FLATPACK, FINE PITCH
|
Peak Reflow Temperature (Cel) |
240
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
3.4 mm
|
3.4 mm
|
Supply Current-Max |
0.33 mA
|
0.33 mA
|
Supply Voltage-Nom |
2.5 V
|
2.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Telecom IC Type |
INTERFACE CIRCUIT
|
INTERFACE CIRCUIT
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Finish |
Tin/Lead (Sn85Pb15)
|
Matte Tin (Sn)
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
40
|
Width |
14 mm
|
14 mm
|
Base Number Matches |
2
|
2
|
Package Description |
|
LEAD FREE, PLASTIC, QFP-128
|
|
|
|
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