KS82C88A-10CP
vs
IS82C89
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
SAMSUNG SEMICONDUCTOR INC
|
INTERSIL CORP
|
Part Package Code |
DIP
|
QLCC
|
Package Description |
DIP, DIP20,.3
|
PLASTIC, LCC-20
|
Pin Count |
20
|
20
|
Reach Compliance Code |
unknown
|
not_compliant
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Bus Compatibility |
8088; 8086
|
8089; 80C88; 8088; 80C86; 8086
|
Clock Frequency-Max |
10 MHz
|
8 MHz
|
JESD-30 Code |
R-PDIP-T20
|
S-PQCC-J20
|
JESD-609 Code |
e0
|
e0
|
Length |
26.6192 mm
|
8.965 mm
|
Number of Terminals |
20
|
20
|
Operating Temperature-Max |
70 °C
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
DIP
|
QCCJ
|
Package Equivalence Code |
DIP20,.3
|
LDCC20,.4SQ
|
Package Shape |
RECTANGULAR
|
SQUARE
|
Package Style |
IN-LINE
|
CHIP CARRIER
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
4.32 mm
|
4.57 mm
|
Supply Current-Max |
5 mA
|
8 mA
|
Supply Voltage-Max |
5.5 V
|
5.5 V
|
Supply Voltage-Min |
4.5 V
|
4.5 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
NO
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
THROUGH-HOLE
|
J BEND
|
Terminal Pitch |
2.54 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
QUAD
|
Width |
7.62 mm
|
8.965 mm
|
uPs/uCs/Peripheral ICs Type |
SYSTEM INTERFACE LOGIC, CONTROL AND COMMAND SIGNAL GENERATOR
|
SYSTEM INTERFACE LOGIC, BUS ARBITER AND CONTINUOUS SIGNAL GENERATOR
|
Base Number Matches |
1
|
4
|
Factory Lead Time |
|
4 Weeks
|
|
|
|
Compare KS82C88A-10CP with alternatives
Compare IS82C89 with alternatives