KS319-50GT
vs
KIS319-50TG
feature comparison
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
ADVANCED INTERCONNECTIONS CORP
|
ADVANCED INTERCONNECTIONS CORP
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8536.69.40.40
|
8536.69.40.40
|
| Body Breadth |
2.1 inch
|
2.1 inch
|
| Body Depth |
0.155 inch
|
0.155 inch
|
| Body Length |
2.1 inch
|
2.1 inch
|
| Contact Configuration |
21X21
|
21X21
|
| Contact Finish Termination |
GOLD OVER NICKEL
|
Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier
|
| Contact Style |
RND PIN-SKT
|
RND PIN-SKT
|
| Device Socket Type |
IC SOCKET
|
IC SOCKET
|
| Device Type Used On |
PGA319
|
PGA319
|
| Housing Material |
POLYIMIDE
|
POLYIMIDE
|
| JESD-609 Code |
e4
|
e0
|
| Mating Contact Pitch |
0.1 inch
|
0.1 inch
|
| Mounting Style |
STRAIGHT
|
STRAIGHT
|
| Number of Contacts |
319
|
319
|
| PCB Contact Pattern |
RECTANGULAR
|
RECTANGULAR
|
| PCB Contact Row Spacing |
0.30000000000000004 mm
|
0.1 mm
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Termination Type |
SOLDER
|
SOLDER
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
No
|
| Rohs Code |
|
No
|
| Additional Feature |
|
1.0 OZ. AVG. INSERTION FORCE
|
| Contact Finish Mating |
|
GOLD OVER NICKEL
|
| Contact Material |
|
BERYLLIUM COPPER
|
| Operating Temperature-Max |
|
400 °C
|
| Operating Temperature-Min |
|
-269 °C
|
|
|
|
Compare KS319-50GT with alternatives
Compare KIS319-50TG with alternatives