KMPC870ZT66
vs
MC9328MX1VM20R2
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Package Description
PLASTIC, BGA-256
Reach Compliance Code
unknown
compliant
HTS Code
8542.31.00.01
Address Bus Width
32
Bit Size
32
Boundary Scan
YES
External Data Bus Width
32
Format
FIXED POINT
Integrated Cache
YES
JESD-30 Code
S-PBGA-B256
JESD-609 Code
e0
Length
23 mm
Low Power Mode
YES
Number of Terminals
256
Package Body Material
PLASTIC/EPOXY
Package Code
HBGA
Package Equivalence Code
BGA256,16X16,50
Package Shape
SQUARE
Package Style
GRID ARRAY, HEAT SINK/SLUG
Qualification Status
Not Qualified
Seated Height-Max
2.54 mm
Speed
66 MHz
Supply Voltage-Max
1.9 V
Supply Voltage-Min
1.7 V
Supply Voltage-Nom
1.8 V
Surface Mount
YES
Technology
CMOS
Terminal Finish
TIN LEAD
Terminal Form
BALL
Terminal Pitch
1.27 mm
Terminal Position
BOTTOM
Width
23 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
Base Number Matches
2
4
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