KMPC8347EZUAJDB
vs
MPC8347EVVADF
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
FREESCALE SEMICONDUCTOR INC
NXP SEMICONDUCTORS
Part Package Code
BGA
Package Description
35 X 35 MM, 1.50 MM HEIGHT, 1 MM PITCH, TBGA-672
LBGA, BGA672,34X34,40
Pin Count
672
Reach Compliance Code
not_compliant
compliant
ECCN Code
5A002
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Base Number Matches
1
2
Address Bus Width
32
Bit Size
32
Boundary Scan
YES
Clock Frequency-Max
66 MHz
External Data Bus Width
32
Format
FLOATING POINT
Integrated Cache
YES
JESD-30 Code
S-PBGA-B672
Length
35 mm
Low Power Mode
YES
Number of Terminals
672
Operating Temperature-Max
105 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
Package Code
LBGA
Package Equivalence Code
BGA672,34X34,40
Package Shape
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
Qualification Status
Not Qualified
Seated Height-Max
1.69 mm
Speed
266 MHz
Supply Voltage-Max
1.26 V
Supply Voltage-Min
1.14 V
Supply Voltage-Nom
1.2 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
OTHER
Terminal Form
BALL
Terminal Pitch
1 mm
Terminal Position
BOTTOM
Width
35 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
Compare KMPC8347EZUAJDB with alternatives
Compare MPC8347EVVADF with alternatives