KMPC8347EVVAGDB
vs
MPC8347ECVVAGDB
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
FREESCALE SEMICONDUCTOR INC
FREESCALE SEMICONDUCTOR INC
Part Package Code
BGA
BGA
Package Description
35 X 35 MM, 1.50 MM HEIGHT, 1 MM PITCH, ROHS COMPLIANT, TBGA-672
35 X 35 MM, 1.46 MM HEIGHT, 1 MM PITCH, LEAD FREE, TBGA-672
Pin Count
672
672
Reach Compliance Code
compliant
compliant
ECCN Code
5A002
5A002
HTS Code
8542.31.00.01
8542.31.00.01
Base Number Matches
1
1
Pbfree Code
Additional Feature
ALSO REQUIRES 2.5V AND 3.3V SUPPLY
Address Bus Width
32
Bit Size
32
Boundary Scan
YES
Clock Frequency-Max
66 MHz
External Data Bus Width
32
Format
FLOATING POINT
Integrated Cache
YES
JESD-30 Code
S-PBGA-B672
JESD-609 Code
e2
Length
35 mm
Low Power Mode
YES
Moisture Sensitivity Level
3
Number of Terminals
672
Operating Temperature-Max
105 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
Package Code
LBGA
Package Equivalence Code
BGA672,34X34,40
Package Shape
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Seated Height-Max
1.69 mm
Speed
400 MHz
Supply Voltage-Max
1.26 V
Supply Voltage-Min
1.14 V
Supply Voltage-Nom
1.2 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
INDUSTRIAL
Terminal Form
BALL
Terminal Pitch
1 mm
Terminal Position
BOTTOM
Time@Peak Reflow Temperature-Max (s)
40
Width
35 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR
Compare KMPC8347EVVAGDB with alternatives
Compare MPC8347ECVVAGDB with alternatives