KMPC8264AVVPJDB
vs
MPC8266AZUPJDB
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
FREESCALE SEMICONDUCTOR INC
MOTOROLA INC
Part Package Code
BGA
Package Description
37.50 X 37.50 MM, 1.55 MM HEIGHT, 1.27 MM PITCH, TBGA-480
Pin Count
480
Reach Compliance Code
not_compliant
unknown
ECCN Code
5A991
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
32
Bit Size
32
32
Boundary Scan
YES
Clock Frequency-Max
83.33 MHz
External Data Bus Width
64
Format
FLOATING POINT
Integrated Cache
YES
JESD-30 Code
S-PBGA-B480
S-PBGA-B480
JESD-609 Code
e1
Length
37.5 mm
Low Power Mode
NO
Moisture Sensitivity Level
3
Number of Terminals
480
480
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
BGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.65 mm
Speed
300 MHz
300 MHz
Supply Voltage-Max
2.2 V
Supply Voltage-Min
1.9 V
Supply Voltage-Nom
2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
40
Width
37.5 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
1
2
Package Equivalence Code
BGA480,29X29,50
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