KMPC8260ACZUMIBB
vs
MPC8260AVVMHBB
feature comparison
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
MOTOROLA INC
|
FREESCALE SEMICONDUCTOR INC
|
| Package Description |
37.50 X 37.50 MM, TBGA-480
|
TBGA-480
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
32
|
32
|
| Bit Size |
32
|
|
| Boundary Scan |
YES
|
YES
|
| External Data Bus Width |
64
|
64
|
| Format |
FLOATING POINT
|
FLOATING POINT
|
| Integrated Cache |
YES
|
YES
|
| JESD-30 Code |
S-PBGA-B480
|
S-PBGA-B480
|
| Length |
37.5 mm
|
37.5 mm
|
| Number of Terminals |
480
|
480
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LBGA
|
LBGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, LOW PROFILE
|
GRID ARRAY, LOW PROFILE
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1.65 mm
|
1.65 mm
|
| Speed |
266 MHz
|
266 MHz
|
| Supply Voltage-Max |
2.7 V
|
2.7 V
|
| Supply Voltage-Min |
2.4 V
|
2.4 V
|
| Supply Voltage-Nom |
2.5 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
37.5 mm
|
37.5 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
| Base Number Matches |
3
|
2
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
| ECCN Code |
|
3A991.A.2
|
| JESD-609 Code |
|
e1
|
| Low Power Mode |
|
YES
|
| Moisture Sensitivity Level |
|
3
|
| Operating Temperature-Max |
|
105 °C
|
| Operating Temperature-Min |
|
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Temperature Grade |
|
OTHER
|
| Terminal Finish |
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
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