KMPC8255ACVVMHBB vs MPC8260AVVMHBB feature comparison

KMPC8255ACVVMHBB Freescale Semiconductor

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MPC8260AVVMHBB NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer FREESCALE SEMICONDUCTOR INC NXP SEMICONDUCTORS
Part Package Code BGA
Package Description 37.50 X 37.50 MM, 1.55 MM HEIGHT, 1.27 MM PITCH, TBGA-480 TBGA-480
Pin Count 480
Reach Compliance Code not_compliant compliant
ECCN Code 5A991 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 32 32
Bit Size 32
Boundary Scan YES YES
Clock Frequency-Max 66.66 MHz
External Data Bus Width 64 64
Format FLOATING POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B480 S-PBGA-B480
JESD-609 Code e1 e1
Length 37.5 mm 37.5 mm
Low Power Mode NO YES
Moisture Sensitivity Level 3 3
Number of Terminals 480 480
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified
Seated Height-Max 1.65 mm 1.65 mm
Speed 266 MHz 266 MHz
Supply Voltage-Max 2.2 V 2.7 V
Supply Voltage-Min 1.9 V 2.4 V
Supply Voltage-Nom 2 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 40 40
Width 37.5 mm 37.5 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 2
Factory Lead Time 2 Days
Operating Temperature-Max 105 °C
Operating Temperature-Min
Temperature Grade OTHER

Compare KMPC8255ACVVMHBB with alternatives

Compare MPC8260AVVMHBB with alternatives