KMM536256BWG-7
vs
MC-424256A36F-80
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
SAMSUNG SEMICONDUCTOR INC
|
NEC ELECTRONICS AMERICA INC
|
| Part Package Code |
SIMM
|
|
| Package Description |
,
|
SIMM-72
|
| Pin Count |
72
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.32.00.02
|
|
| Access Mode |
FAST PAGE
|
PAGE
|
| Access Time-Max |
70 ns
|
80 ns
|
| Additional Feature |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
|
RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH
|
| Alternate Memory Width |
18
|
|
| JESD-30 Code |
R-XSMA-N72
|
R-XSMA-N72
|
| Memory Density |
9437184 bit
|
9437184 bit
|
| Memory IC Type |
FAST PAGE DRAM MODULE
|
DRAM MODULE
|
| Memory Width |
36
|
36
|
| Number of Functions |
1
|
1
|
| Number of Ports |
1
|
1
|
| Number of Terminals |
72
|
72
|
| Number of Words |
262144 words
|
262144 words
|
| Number of Words Code |
256000
|
256000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Organization |
256KX36
|
256KX36
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
MICROELECTRONIC ASSEMBLY
|
MICROELECTRONIC ASSEMBLY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Refresh Cycles |
512
|
1024
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.25 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.75 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Position |
SINGLE
|
SINGLE
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare KMM536256BWG-7 with alternatives
Compare MC-424256A36F-80 with alternatives