KMM5324004BK/BKG-6 vs MB324DJ00TBSN60 feature comparison

KMM5324004BK/BKG-6 Samsung Semiconductor

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MB324DJ00TBSN60 Motorola Mobility LLC

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC MOTOROLA INC
Part Package Code SIMM SIMM
Package Description SIMM, ,
Pin Count 72 72
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.02 8542.32.00.02
Access Mode FAST PAGE WITH EDO FAST PAGE WITH EDO
Access Time-Max 60 ns 60 ns
JESD-30 Code R-XSMA-N72 R-XSMA-N72
Memory Density 134217728 bit 134217728 bit
Memory IC Type EDO DRAM MODULE EDO DRAM MODULE
Memory Width 32 32
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 72 72
Number of Words 4194304 words 4194304 words
Number of Words Code 4000000 4000000
Organization 4MX32 4MX32
Package Body Material UNSPECIFIED UNSPECIFIED
Package Code SIMM
Package Shape RECTANGULAR RECTANGULAR
Package Style MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
Qualification Status Not Qualified Not Qualified
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS MOS
Terminal Form NO LEAD NO LEAD
Terminal Position SINGLE SINGLE
Base Number Matches 1 3
Additional Feature RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
Alternate Memory Width 16
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Output Characteristics 3-STATE
Refresh Cycles 2048
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Temperature Grade COMMERCIAL

Compare KMM5324004BK/BKG-6 with alternatives

Compare MB324DJ00TBSN60 with alternatives