KMM5321204C2WG
vs
HB56U132SB-6C
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
SAMSUNG SEMICONDUCTOR INC
|
HITACHI LTD
|
Part Package Code |
SIMM
|
MODULE
|
Package Description |
,
|
SIMM, SSIM72
|
Pin Count |
72
|
72
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.02
|
8542.32.00.02
|
Access Mode |
FAST PAGE WITH EDO
|
FAST PAGE WITH EDO
|
Access Time-Max |
60 ns
|
60 ns
|
Additional Feature |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
|
RAS ONLY/CAS BEFORE RAS REFRESH
|
JESD-30 Code |
R-XSMA-N72
|
R-XSMA-N72
|
Memory Density |
33554432 bit
|
33554432 bit
|
Memory IC Type |
EDO DRAM MODULE
|
EDO DRAM MODULE
|
Memory Width |
32
|
32
|
Number of Functions |
1
|
1
|
Number of Ports |
1
|
1
|
Number of Terminals |
72
|
72
|
Number of Words |
1048576 words
|
1048576 words
|
Number of Words Code |
1000000
|
1000000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Organization |
1MX32
|
1MX32
|
Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
MICROELECTRONIC ASSEMBLY
|
MICROELECTRONIC ASSEMBLY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.25 V
|
Supply Voltage-Min (Vsup) |
4.5 V
|
4.75 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
NO
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Position |
SINGLE
|
SINGLE
|
Base Number Matches |
3
|
1
|
I/O Type |
|
COMMON
|
Output Characteristics |
|
3-STATE
|
Package Code |
|
SIMM
|
Package Equivalence Code |
|
SSIM72
|
Refresh Cycles |
|
1024
|
Standby Current-Max |
|
0.008 A
|
Supply Current-Max |
|
1.04 mA
|
Terminal Pitch |
|
1.27 mm
|
|
|
|
Compare KMM5321204C2WG with alternatives
Compare HB56U132SB-6C with alternatives