KMM466S823DT2-G0 vs MB8508S064CE-100LDG feature comparison

KMM466S823DT2-G0 Samsung Semiconductor

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MB8508S064CE-100LDG FUJITSU Semiconductor Limited

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC FUJITSU LTD
Part Package Code MODULE DIMM
Package Description DIMM, DIMM144,32 ,
Pin Count 144 144
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.28 8542.32.00.28
Access Mode FOUR BANK PAGE BURST FOUR BANK PAGE BURST
Access Time-Max 7 ns 8.5 ns
Additional Feature AUTO/SELF REFRESH
Clock Frequency-Max (fCLK) 100 MHz
I/O Type COMMON
JESD-30 Code R-XDMA-N144 R-PDMA-N144
Memory Density 536870912 bit 536870912 bit
Memory IC Type SYNCHRONOUS DRAM MODULE SYNCHRONOUS DRAM MODULE
Memory Width 64 64
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 144 144
Number of Words 8388608 words 8388608 words
Number of Words Code 8000000 8000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 8MX64 8MX64
Output Characteristics 3-STATE
Package Body Material UNSPECIFIED PLASTIC/EPOXY
Package Code DIMM
Package Equivalence Code DIMM144,32
Package Shape RECTANGULAR RECTANGULAR
Package Style MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
Qualification Status Not Qualified Not Qualified
Refresh Cycles 4096
Seated Height-Max 29.21 mm
Self Refresh YES
Standby Current-Max 0.008 A
Supply Current-Max 1 mA
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form NO LEAD NO LEAD
Terminal Pitch 0.8 mm
Terminal Position DUAL DUAL
Base Number Matches 1 2

Compare KMM466S823DT2-G0 with alternatives

Compare MB8508S064CE-100LDG with alternatives