KMM464S1654AT1-FL vs MT8LSDT1664HIG-133XX feature comparison

KMM464S1654AT1-FL Samsung Semiconductor

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MT8LSDT1664HIG-133XX Micron Technology Inc

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC MICRON TECHNOLOGY INC
Package Description , SODIMM-144
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.32 8542.32.00.32
Access Mode FOUR BANK PAGE BURST DUAL BANK PAGE BURST
Access Time-Max 6 ns 5.4 ns
Additional Feature AUTO/SELF REFRESH AUTO/SELF REFRESH
JESD-30 Code R-XDMA-N144 R-XZMA-N144
Memory Density 1073741824 bit 1073741824 bit
Memory IC Type SYNCHRONOUS DRAM MODULE SYNCHRONOUS DRAM MODULE
Memory Width 64 64
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 144 144
Number of Words 16777216 words 16777216 words
Number of Words Code 16000000 16000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 16MX64 16MX64
Package Body Material UNSPECIFIED UNSPECIFIED
Package Shape RECTANGULAR RECTANGULAR
Package Style MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
Qualification Status Not Qualified Not Qualified
Self Refresh YES YES
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Form NO LEAD NO LEAD
Terminal Position DUAL ZIG-ZAG
Base Number Matches 1 1
Pbfree Code No
Rohs Code No
Part Package Code SODIMM
Pin Count 144
Length 67.585 mm
Package Code DIMM
Peak Reflow Temperature (Cel) 235
Seated Height-Max 3.8 mm
Time@Peak Reflow Temperature-Max (s) 30
Width 31.75 mm

Compare KMM464S1654AT1-FL with alternatives

Compare MT8LSDT1664HIG-133XX with alternatives