KMM374S823BTL-GL
vs
GMM2739233ETG-7J
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SAMSUNG SEMICONDUCTOR INC
SK HYNIX INC
Package Description
,
DIMM, DIMM168
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.32
8542.32.00.32
Access Mode
FOUR BANK PAGE BURST
SINGLE BANK PAGE BURST
Access Time-Max
6 ns
6 ns
Additional Feature
AUTO/SELF REFRESH
AUTO/SELF REFRESH
JESD-30 Code
R-XDMA-N168
R-XDMA-N168
Memory Density
603979776 bit
603979776 bit
Memory IC Type
SYNCHRONOUS DRAM MODULE
SYNCHRONOUS DRAM MODULE
Memory Width
72
72
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
168
168
Number of Words
8388608 words
8388608 words
Number of Words Code
8000000
8000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
8MX72
8MX72
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
MICROELECTRONIC ASSEMBLY
MICROELECTRONIC ASSEMBLY
Qualification Status
Not Qualified
Not Qualified
Self Refresh
YES
YES
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
NO LEAD
NO LEAD
Terminal Position
DUAL
DUAL
Base Number Matches
1
2
Part Package Code
DIMM
Pin Count
168
Clock Frequency-Max (fCLK)
100 MHz
I/O Type
COMMON
Output Characteristics
3-STATE
Package Code
DIMM
Package Equivalence Code
DIMM168
Refresh Cycles
4096
Standby Current-Max
0.015 A
Supply Current-Max
1 mA
Terminal Pitch
1.27 mm
Compare KMM374S823BTL-GL with alternatives
Compare GMM2739233ETG-7J with alternatives