KMM372E883BK-6
vs
HYM72V8045GS-50
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
SAMSUNG SEMICONDUCTOR INC
|
INFINEON TECHNOLOGIES AG
|
Package Description |
DIMM, DIMM168
|
DIMM, DIMM168
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.32
|
8542.32.00.71
|
Access Mode |
FAST PAGE WITH EDO
|
|
Access Time-Max |
60 ns
|
50 ns
|
Additional Feature |
CAS BEFORE RAS REFRESH; RAS ONLY/HIDDEN REFRESH
|
|
I/O Type |
COMMON
|
COMMON
|
JESD-30 Code |
R-XDMA-N168
|
R-PDMA-N168
|
Memory Density |
603979776 bit
|
603979776 bit
|
Memory IC Type |
EDO DRAM MODULE
|
|
Memory Width |
72
|
72
|
Number of Functions |
1
|
|
Number of Ports |
1
|
|
Number of Terminals |
168
|
168
|
Number of Words |
8388608 words
|
8388608 words
|
Number of Words Code |
8000000
|
8000000
|
Operating Mode |
ASYNCHRONOUS
|
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Organization |
8MX72
|
8MX72
|
Output Characteristics |
3-STATE
|
3-STATE
|
Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
Package Code |
DIMM
|
DIMM
|
Package Equivalence Code |
DIMM168
|
DIMM168
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
MICROELECTRONIC ASSEMBLY
|
MICROELECTRONIC ASSEMBLY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Refresh Cycles |
8192
|
4096
|
Standby Current-Max |
0.03 A
|
0.03 A
|
Supply Current-Max |
0.81 mA
|
1.8 mA
|
Supply Voltage-Max (Vsup) |
5.5 V
|
|
Supply Voltage-Min (Vsup) |
4.5 V
|
|
Supply Voltage-Nom (Vsup) |
5 V
|
3.3 V
|
Surface Mount |
NO
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
DUAL
|
Base Number Matches |
1
|
2
|
Seated Height-Max |
|
38.1 mm
|
|
|
|
Compare KMM372E883BK-6 with alternatives
Compare HYM72V8045GS-50 with alternatives