KMC9328MXLVH15
vs
MC9328MXL15
feature comparison
All Stats
Differences Only
Rohs Code
No
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
FREESCALE SEMICONDUCTOR INC
MOTOROLA INC
Part Package Code
BGA
BGA
Package Description
LFBGA,
LFBGA, BGA256,16X16,32
Pin Count
256
256
Reach Compliance Code
not_compliant
unknown
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
25
25
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
16 MHz
16 MHz
External Data Bus Width
32
32
Format
FIXED POINT
FIXED POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B256
S-PBGA-B256
JESD-609 Code
e0
Length
14 mm
14 mm
Low Power Mode
YES
YES
Moisture Sensitivity Level
3
Number of Terminals
256
256
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFBGA
LFBGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
220
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.6 mm
1.6 mm
Speed
150 MHz
150 MHz
Supply Voltage-Max
1.9 V
1.9 V
Supply Voltage-Min
1.7 V
1.7 V
Supply Voltage-Nom
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
Tin/Lead/Silver (Sn/Pb/Ag)
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
Width
14 mm
14 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR
Base Number Matches
3
3
Package Equivalence Code
BGA256,16X16,32
Compare KMC9328MXLVH15 with alternatives
Compare MC9328MXL15 with alternatives