KMC912DG128ACPV
vs
MC912DG128AVPVE
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Not Recommended
Ihs Manufacturer
MOTOROLA INC
NXP SEMICONDUCTORS
Part Package Code
QFP
Package Description
LQFP,
TQFP-112
Pin Count
112
Reach Compliance Code
unknown
compliant
HTS Code
8542.31.00.01
8542.31.00.01
Has ADC
YES
YES
Address Bus Width
16
16
Bit Size
16
16
Clock Frequency-Max
16 MHz
16 MHz
DAC Channels
NO
NO
DMA Channels
NO
NO
External Data Bus Width
16
16
JESD-30 Code
S-PQFP-G112
S-PQFP-G112
Length
20 mm
20 mm
Number of I/O Lines
83
83
Number of Terminals
112
112
Operating Temperature-Max
85 °C
105 °C
Operating Temperature-Min
-40 °C
-40 °C
PWM Channels
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LQFP
LQFP
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, LOW PROFILE
FLATPACK, LOW PROFILE
Qualification Status
Not Qualified
Not Qualified
ROM Programmability
FLASH
FLASH
Seated Height-Max
1.6 mm
1.6 mm
Speed
8 MHz
8 MHz
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
4.5 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
HCMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
QUAD
QUAD
Width
20 mm
20 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
MICROCONTROLLER
Base Number Matches
3
2
Rohs Code
ECCN Code
EAR99
Factory Lead Time
13 Weeks
Samacsys Manufacturer
NXP
Boundary Scan
NO
JESD-609 Code
e3
Moisture Sensitivity Level
3
On Chip Program ROM Width
8
Peak Reflow Temperature (Cel)
260
ROM (words)
131072
Terminal Finish
Tin (Sn)
Time@Peak Reflow Temperature-Max (s)
40
Compare KMC912DG128ACPV with alternatives
Compare MC912DG128AVPVE with alternatives