KM93C66G
vs
BR24L256FV-WE2
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
SAMSUNG SEMICONDUCTOR INC
|
ROHM CO LTD
|
| Part Package Code |
SOIC
|
SOIC
|
| Package Description |
SOP, SOP8,.25
|
LSSOP,
|
| Pin Count |
8
|
8
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Clock Frequency-Max (fCLK) |
1 MHz
|
0.4 MHz
|
| Data Retention Time-Min |
10
|
|
| Endurance |
100000 Write/Erase Cycles
|
|
| JESD-30 Code |
R-PDSO-G8
|
R-PDSO-G8
|
| JESD-609 Code |
e0
|
|
| Length |
5.02 mm
|
4.4 mm
|
| Memory Density |
4096 bit
|
262144 bit
|
| Memory IC Type |
EEPROM
|
EEPROM
|
| Memory Width |
16
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Number of Words |
256 words
|
32768 words
|
| Number of Words Code |
256
|
32000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Organization |
256X16
|
32KX8
|
| Output Characteristics |
3-STATE
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
LSSOP
|
| Package Equivalence Code |
SOP8,.25
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
|
| Parallel/Serial |
SERIAL
|
SERIAL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.95 mm
|
1.5 mm
|
| Serial Bus Type |
MICROWIRE
|
I2C
|
| Standby Current-Max |
0.00005 A
|
|
| Supply Current-Max |
0.003 mA
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
1.8 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
PURE TIN
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
3.94 mm
|
3 mm
|
| Write Cycle Time-Max (tWC) |
10 ms
|
5 ms
|
| Write Protection |
SOFTWARE
|
|
| Base Number Matches |
1
|
1
|
| Moisture Sensitivity Level |
|
1
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Time@Peak Reflow Temperature-Max (s) |
|
10
|
|
|
|
Compare KM93C66G with alternatives
Compare BR24L256FV-WE2 with alternatives