KM75C104AP-35
vs
MS7204-35PC
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Contact Manufacturer
|
| Ihs Manufacturer |
SAMSUNG SEMICONDUCTOR INC
|
MOS ELECTRONICS TAIWAN CORP
|
| Part Package Code |
DIP
|
|
| Package Description |
DIP, DIP28,.6
|
,
|
| Pin Count |
28
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.71
|
8542.32.00.71
|
| Access Time-Max |
35 ns
|
|
| Additional Feature |
RETRANSMIT
|
|
| Clock Frequency-Max (fCLK) |
22.2 MHz
|
|
| Cycle Time |
45 ns
|
|
| JESD-30 Code |
R-PDIP-T28
|
|
| JESD-609 Code |
e0
|
|
| Length |
37.1 mm
|
|
| Memory Density |
36864 bit
|
|
| Memory IC Type |
OTHER FIFO
|
|
| Memory Width |
9
|
|
| Number of Functions |
1
|
|
| Number of Terminals |
28
|
|
| Number of Words |
4096 words
|
|
| Number of Words Code |
4000
|
|
| Operating Mode |
ASYNCHRONOUS
|
|
| Operating Temperature-Max |
70 °C
|
|
| Operating Temperature-Min |
|
|
| Organization |
4KX9
|
|
| Output Characteristics |
3-STATE
|
|
| Output Enable |
NO
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
DIP
|
|
| Package Equivalence Code |
DIP28,.6
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
IN-LINE
|
|
| Parallel/Serial |
PARALLEL
|
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
5.08 mm
|
|
| Standby Current-Max |
0.005 A
|
|
| Supply Current-Max |
0.1 mA
|
|
| Supply Voltage-Nom (Vsup) |
5 V
|
|
| Surface Mount |
NO
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
COMMERCIAL
|
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
THROUGH-HOLE
|
|
| Terminal Pitch |
2.54 mm
|
|
| Terminal Position |
DUAL
|
|
| Width |
15.24 mm
|
|
| Base Number Matches |
1
|
2
|
|
|
|
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