KM75C02AP-25 vs LH5497-25 feature comparison

KM75C02AP-25 Samsung Semiconductor

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LH5497-25 Sharp Corp

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC SHARP CORP
Part Package Code DIP
Package Description DIP, DIP28,.6 0.600 INCH, PLASTIC, DIP-28
Pin Count 28
Reach Compliance Code unknown unknown
ECCN Code EAR99
HTS Code 8542.32.00.71
Access Time-Max 25 ns 25 ns
Additional Feature RETRANSMIT RETRANSMIT
Clock Frequency-Max (fCLK) 28 MHz 28 MHz
Cycle Time 35 ns 35 ns
JESD-30 Code R-PDIP-T28 R-PDIP-T28
JESD-609 Code e0 e0
Length 36.32 mm 36 mm
Memory Density 9216 bit 9216 bit
Memory IC Type OTHER FIFO OTHER FIFO
Memory Width 9 9
Number of Functions 1 1
Number of Terminals 28 28
Number of Words 1024 words 1024 words
Number of Words Code 1000 1000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 1KX9 1KX9
Output Characteristics 3-STATE 3-STATE
Output Enable NO NO
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP28,.6 DIP28,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 5.2 mm
Standby Current-Max 0.005 A 0.005 A
Supply Current-Max 0.12 mA 0.1 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm 15.24 mm
Base Number Matches 1 1