KM732V789H-67
vs
IBM0436A41QLAB-3P
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
SAMSUNG SEMICONDUCTOR INC
|
IBM MICROELECTRONICS
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
BGA,
|
BGA, BGA119,7X17,50
|
| Pin Count |
119
|
119
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
3A991.B.2.A
|
3A991.B.2.A
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
No
|
| Rohs Code |
|
No
|
| Access Time-Max |
|
1.5 ns
|
| I/O Type |
|
COMMON
|
| JESD-30 Code |
|
R-PBGA-B119
|
| JESD-609 Code |
|
e0
|
| Length |
|
22 mm
|
| Memory Density |
|
4718592 bit
|
| Memory IC Type |
|
STANDARD SRAM
|
| Memory Width |
|
36
|
| Number of Functions |
|
1
|
| Number of Terminals |
|
119
|
| Number of Words |
|
131072 words
|
| Number of Words Code |
|
128000
|
| Operating Mode |
|
SYNCHRONOUS
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
|
| Organization |
|
128KX36
|
| Output Characteristics |
|
3-STATE
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
BGA
|
| Package Equivalence Code |
|
BGA119,7X17,50
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
GRID ARRAY
|
| Parallel/Serial |
|
PARALLEL
|
| Qualification Status |
|
Not Qualified
|
| Seated Height-Max |
|
2.679 mm
|
| Standby Current-Max |
|
0.1 A
|
| Standby Voltage-Min |
|
3.14 V
|
| Supply Current-Max |
|
0.47 mA
|
| Supply Voltage-Max (Vsup) |
|
3.63 V
|
| Supply Voltage-Min (Vsup) |
|
3.135 V
|
| Supply Voltage-Nom (Vsup) |
|
3.3 V
|
| Surface Mount |
|
YES
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
OTHER
|
| Terminal Finish |
|
TIN LEAD
|
| Terminal Form |
|
BALL
|
| Terminal Pitch |
|
1.27 mm
|
| Terminal Position |
|
BOTTOM
|
| Width |
|
14 mm
|
|
|
|
Compare KM732V789H-67 with alternatives
Compare IBM0436A41QLAB-3P with alternatives