KM684000BLGI-5L0
vs
K6T4008C1C-VF550
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SAMSUNG SEMICONDUCTOR INC
SAMSUNG SEMICONDUCTOR INC
Part Package Code
SOIC
TSOP2
Package Description
SOP,
TSOP2,
Pin Count
32
32
Reach Compliance Code
unknown
compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
55 ns
55 ns
JESD-30 Code
R-PDSO-G32
R-PDSO-G32
Length
20.47 mm
20.95 mm
Memory Density
4194304 bit
4194304 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
32
32
Number of Words
524288 words
524288 words
Number of Words Code
512000
512000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
512KX8
512KX8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
TSOP2
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE, THIN PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3 mm
1.2 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
11.43 mm
10.16 mm
Base Number Matches
1
1
Rohs Code
Compare KM684000BLGI-5L0 with alternatives
Compare K6T4008C1C-VF550 with alternatives