KM681002CTI-1500
vs
L7C108KMB15
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SAMSUNG SEMICONDUCTOR INC
LOGIC DEVICES INC
Part Package Code
TSOP2
QFJ
Package Description
TSOP2,
QCCN,
Pin Count
32
32
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.B.2.B
3A001.A.2.C
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
15 ns
15 ns
JESD-30 Code
R-PDSO-G32
R-CQCC-N32
Length
20.95 mm
17.78 mm
Memory Density
1048576 bit
1048576 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
32
32
Number of Words
131072 words
131072 words
Number of Words Code
128000
128000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Organization
128KX8
128KX8
Package Body Material
PLASTIC/EPOXY
CERAMIC, METAL-SEALED COFIRED
Package Code
TSOP2
QCCN
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE
CHIP CARRIER
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
2.54 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Form
GULL WING
NO LEAD
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
QUAD
Width
10.16 mm
11.43 mm
Base Number Matches
1
1
Rohs Code
Additional Feature
AUTOMATIC POWER DOWN; BATTERY BACKUP
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
225
Compare KM681002CTI-1500 with alternatives
Compare L7C108KMB15 with alternatives