KM681000LG-8
vs
UPD431000GW-85L
feature comparison
All Stats
Differences Only
Rohs Code
No
No
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SAMSUNG SEMICONDUCTOR INC
RENESAS ELECTRONICS CORP
Part Package Code
SOIC
Package Description
SOP, SOP32,.56
MINIFP-32
Pin Count
32
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.41
8542.32.00.41
Category CO2 Kg
12
Compliance Temperature Grade
Commercial: +0C to +70C
Access Time-Max
85 ns
85 ns
Additional Feature
BATTERY BACKUP
I/O Type
COMMON
COMMON
JESD-30 Code
R-PDSO-G32
R-PDFP-F32
JESD-609 Code
e0
e0
Length
20.47 mm
Memory Density
1048576 bit
1048576 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
8
8
Number of Functions
1
1
Number of Ports
1
Number of Terminals
32
32
Number of Words
131072 words
131072 words
Number of Words Code
128000
128000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
128KX8
128KX8
Output Characteristics
3-STATE
3-STATE
Output Enable
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
DFP
Package Equivalence Code
SOP32,.56
SOP32,.56
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
FLATPACK
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3 mm
Standby Current-Max
0.00005 A
0.00005 A
Standby Voltage-Min
2 V
2 V
Supply Current-Max
0.07 mA
0.07 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
Tin/Lead (Sn/Pb)
Terminal Form
GULL WING
FLAT
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
11.43 mm
Base Number Matches
2
2
Compare KM681000LG-8 with alternatives
Compare UPD431000GW-85L with alternatives