KM64257AP-45 vs KM64257P-45 feature comparison

KM64257AP-45 Samsung Semiconductor

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KM64257P-45 Samsung Semiconductor

Buy Now Datasheet
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC SAMSUNG SEMICONDUCTOR INC
Part Package Code DIP
Package Description DIP, DIP24,.3 DIP, DIP24,.3
Pin Count 24
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 45 ns 45 ns
Additional Feature BATTERY BACKUP
I/O Type COMMON COMMON
JESD-30 Code R-PDIP-T24 R-PDIP-T24
JESD-609 Code e0 e0
Length 31.625 mm
Memory Density 262144 bit 262144 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 4 4
Number of Functions 1
Number of Ports 1
Number of Terminals 24 24
Number of Words 65536 words 65536 words
Number of Words Code 64000 64000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 64KX4 64KX4
Output Characteristics 3-STATE 3-STATE
Output Enable NO
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP24,.3 DIP24,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm
Standby Current-Max 0.002 A 0.002 A
Standby Voltage-Min 4.5 V 4.5 V
Supply Current-Max 0.1 mA 0.12 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm
Base Number Matches 1 1
Pbfree Code No
Moisture Sensitivity Level 3

Compare KM64257AP-45 with alternatives

Compare KM64257P-45 with alternatives